Development of Innovative Nanocopper-based Formulations for Agricultural Applications.
Τ1ΕΔΚ-01492 (funded by the General Secretariat for Research & Technology Hellas)
The intensification of agriculture in Greece and the continuous growth of this sector, are widely considered basic pillars of sustainable development for the country. It is however, widely accepted that an increase of production can only be achieved through research, technology and innovation. Although significant funds have been allocated to such actions in recent years, 50% of the related investments in Greece concern the development and characterization of seeds and propagating material.
On the other hand, the growing environmental requirements and related European legislation for the use of plant protection products (biocides, herbicides, pesticides, insecticides, etc.), pose serious risks to the competitiveness of domestic agricultural production, as pests and insects are becoming increasingly resistant to conventional plant protection products. The aim of this research project is therefore to develop a new generation of biocides that provide the desired level of protection for a specific category of crops, while complying with existing and expected legislation on the use of biocidal products in agriculture.
ASSEMBLY AND WIRE-BONDING OF ELECTRONIC CIRCUITS USING LASER PRINTING PROCESSES
Τ1ΕΔΚ-00814 (funded by the General Secretariat for Research & Technology Hellas)
The present project aims at the development of new processes for the assembly and the wire bonding of electronic circuits with digital laser printing and sintering technology. In order to integrate them into industrial processes of packaging and production of electronic circuits, the packaged integrated circuits which will be achieved by laser printing will undergo the assembly process also with laser printing in order to demonstrate fully functional electronic circuits with contact sizes smaller than the current limit of the surface mount technology. During the project, printable materials with silver and copper nanoparticles will be designed, manufactured and characterized by two project partners, until their properties are optimized for high-conductivity and high mechanical strength interconnections. The proposed technological breakthrough lies in the increase of the printing speed and reasolution of electronic circuit assembly and wirebonding, and will be a valuable innovation for the field of microelectronics... read more